8808-SYS

8808-SYS Specification

Operating temperature

32 to 104°F (0 to 40°C)

Nonoperating temperature

-40 to 158°F (-40 to 70°C)

Humidity

5% to 95% (noncondensing)

Altitude

0 to 9842 ft. (0 to 3000 m)

Feature

2 route processors

Intel Broadwell 4-core 2.4 GHz CPU with 32 GB of DRAM. RS-232 console, 10 GbE Control Plane expansion SFP+, 1 GbE Management & BMC port, 2x USB2.0, GBP (ToD, 10MHz, 1PPS), 1588, and BITs (sync).

Cable management, doors, and air filters

6.3 KW power supply for AC and high-voltage DC (180 to 305V AC, 192 to 200V DC)

4.4 KW power supply for 48V 60A DC (-40 to -75V DC)

4.8 KW power supply for 48V 100A DC (-40 to -75V DC)

Horizontal line cards with 8 vertical fabric cards and 4 fan trays

Rack mountable in standard 19 in. (48.3 cm) rack

Power Supply

Typical system power at 115.2 Tbps: 13 KW

9 high-voltage power supplies or 12 48V DC power supplies

Dimension

(H) 28 x (W) 17.45 x (D) 33.73 in. (71.12 x 44.32 x 85.7 cm) – 16 RU – 8 line cards

Depth with cable management, filter, and doors: 41.18 in. (104.6 cm)

Regulatory compliance

Products should comply with CE Markings according to directives 2004/108/EC and 2006/95/EC.

Safety

UL 60950-1 Second Edition

CAN/CSA-C22.2 No. 60950-1 Second Edition

EN 60950-1 Second Edition

IEC 60950-1 Second Edition

AS/NZS 60950-1

GB4943

EMC: Emissions

47CFR Part 15 (CFR 47) Class A

AS/NZS CISPR22 Class A

CISPR22 Class A

EN55022 Class A

ICES003 Class A

VCCI Class A

EN61000-3-2

EN61000-3-3

KN32 Class A

CNS13438 Class A

EMC: Immunity

EN55024

CISPR24

EN300386

KN 61000-4 Series

RoHS

The product is RoHS-6 compliant with exceptions for leaded-ball grid-array (BGA) balls and lead press-fit connectors.